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z5 - p1 C high - power led product brief description key applications features and benefits rev1.0 , november 18, 2013 www.seoulsemicon.com 1 z power led C z5 - p1 ? the z - power series is designed for high flux output applications with high current operation capability. ? it incorporates state of the art smd design and low thermal resistant material. ? the z power led is ideal light sources for directional lighting applications such as spot lights, various outdoor applications, automotive lightings and high performance torches . ? high lumen output and efficacy ? designed for high current operation ? low thermal resistance ? wide cct range 2600~7000k ? high color quality ? ansi compliant binning ? macadam 3 step for warm white ? indoor lighting ? outdoor lighting ? automotive ? architectural lighting ? industrial lighting (high/low bay) ? portable torch ? home appliance part number cct cri color min. typ. max. min sz5 - p1 - w0 - 00 cool white 4700k 5300k 7000k 70 sz5 - p1 - wn - 00 neutral white 3700k 4000k 4700k 70 sz5 - p1 - wn - c8 neutral white 3700k 4000k 4700k 80 sz5 - p1 - ww - c8 warm white 2600k 3000k 3700k 80 table 1. product selection table rohs macadam 3 - step sz5 - p1 - wx - xx (cool, neutral, warm) superior efficacy and lumen output with small form factor
rev1.0, november 18, 2013 www.seoulsemicon.com z5 - p1 C high - power led 2 table of contents index ? product brief ? table of contents ? performance characteristics ? color bin structure ? mechanical dimensions ? packagi ng information ? product nomenclature ( labeling information ) ? recommended solder pad ? reflow soldering characteristics ? handling of silicone resin for leds ? precaution for use ? company information
rev1.0, november 18, 2013 www.seoulsemicon.com z5 - p1 C high - power led 3 performance characteristics part number cct (k) [1] typical luminous flux [2] v [3] (lm) typical forward voltage (v f ) [4] cri [5] , r a viewing angle (degree s) 2 ? typ. 350ma 700m* 1.0a* 350ma 700m* 1.0a* min. typ. sz5 - p1 - w0 - 00 5300 148 260 338 3.05 3.26 3.39 70 118 sz5 - p1 - wn - 00 4000 143 251 327 3.05 3.26 3.39 70 118 sz5 - p1 - wn - c8 4000 128 225 292 3.05 3.26 3.39 80 118 sz5 - p1 - ww - c8 3000 115 202 263 3.05 3.26 3.39 80 118 table 2. electro optical characteristics, t j = 25oc, rh30% part number cct (k) [1] typical luminous flux [2] v [3] (lm) typical forward voltage (v f ) [4] typ. 350ma 700ma* 1.0a* 350ma 700ma* 1.0a* sz5 - p1 - w0 - 00 5300 134 235 304 2.90 3.11 3.23 sz5 - p1 - wn - 00 4000 129 226 294 2.90 3.11 3.23 sz5 - p1 - wn - c8 4000 115 202 263 2.90 3.11 3.23 sz5 - p1 - ww - c8 3000 104 182 236 2.90 3.11 3.23 (1) correlated color temperature is derived from the cie 1931 chromaticity diagram. color coordinate : ? 0.005, cct ? 5% tolerance. (2) seoul semiconductor maintains a tolerance of ? 7% on flux and power measurements. (3) v is the total luminous flux output as measured with an integrating sphere. (4) tolerance is ? 0.06v on forward voltage measurements. (5) tolerance is ? 2.0 on cri measurements. * no values are provided by real measurement. only for reference purpose. notes : table 3. electro optical characteristics , t j = 85oc
rev1.0, november 18, 2013 www.seoulsemicon.com z5 - p1 C high - power led 4 performance characteristics parameter symbol value unit min. typ. max. forward current [1] i f - - 1.0 a peak pulsed forward current [2] i f 1.6 a reverse voltage v r - - 5 v power dissipation p d - - 3.39 w junction temperature t j - - 150 oc operating temperature t opr - 40 - 125 oc storage temperature t stg - 40 - 125 oc thermal resistance (j to s) [3] r j - s - 5.5 - k/w esd sensitivity(hbm) [4] class 3a jesd22 - a114 - e table 4. absolute maximum ratings, t j = 25oc notes : (1) at junction temperature 25 condition. (2) pulse width 10ms, duty cycle 10% condition. (3) r j - s is tested at 350ma. (4) the zener diode is included to protect the product from esd.
rev1.0, november 18, 2013 www.seoulsemicon.com z5 - p1 C high - power led 5 relative spectral distribution fig 1. color spectrum ( t j = 25oc ) fig 2. typical spatial distribution 350 400 450 500 550 600 650 700 750 800 0.00 0.25 0.50 0.75 1.00 1.25 relative radiant power [%] wavelength [nm] cool white neutral white warm white -80 -60 -40 -20 0 20 40 60 80 0 10 20 30 40 50 60 70 80 90 100 relative luminous intensity [%] angular displacement [degrees]
rev1.0, november 18, 2013 www.seoulsemicon.com z5 - p1 C high - power led 6 forward current characteristics fig 3. forward voltage vs. forward current ( t j = 25oc ) fig 4. forward current vs. relative luminous flux (t j =25 ) 2.4 2.6 2.8 3.0 3.2 3.4 3.6 3.8 0.0 0.2 0.4 0.6 0.8 1.0 1.2 forward voltage [v] forward current [a] 0 200 400 600 800 1000 1200 0 50 100 150 200 250 300 relative luminous flux [%] forward current [ma]
rev1.0, november 18, 2013 www.seoulsemicon.com z5 - p1 C high - power led 7 forward current characteristics fig 5. forward current vs. cie x, y shift, t j = 25oc 0 200 400 600 800 1000 -0.02 -0.01 0.00 0.01 0.02 forward current [ma] ?? cie(x) ??? cie(y)
rev1.0, november 18, 2013 www.seoulsemicon.com z5 - p1 C high - power led 8 junction temperature characteristics fig 6. relative light output vs. junction temperature, i f = 350ma fig 7. junction temp. vs. cie x, y shift, i f = 350ma 25 50 75 100 125 150 0 20 40 60 80 100 120 relative luminous flux [%] junction temperature [ o c ] 25 50 75 100 125 150 -0.02 -0.01 0.00 0.01 0.02 junction temperature [ o c ] ? cie(x) ? cie(y)
rev1.0, november 18, 2013 www.seoulsemicon.com z5 - p1 C high - power led 9 junction temperature characteristics fig 8. relative forward vs. junction temperature, i f = 350ma 40 60 80 100 120 140 160 -0.30 -0.25 -0.20 -0.15 -0.10 -0.05 0.00 0.05 ? v f junction temperature [ ?
rev1.0, november 18, 2013 www.seoulsemicon.com z5 - p1 C high - power led 10 ambient temperature characteristics fig 9. maximum forward current vs. ambient temperature, tj (max.) = 150 , i f =1.0a rth (j - a )=15 /w rth (j - a)= 20 /w rth (j - a )=25 /w 0 20 40 60 80 100 120 140 0.0 0.2 0.4 0.6 0.8 1.0 1.2 maximum current [a] ambient temperature [ o c ]
rev1.0, november 18, 2013 www.seoulsemicon.com z5 - p1 C high - power led 11 color bin structure part number luminous flux (lm) color chromaticity coordinate typical forward voltage (v f ) bin code min. max. bin code min. max. sz5 - p1 - w0 - 00 v1 118.5 130 refer to page.12 g 2.75 3.00 v2 130 140 h 3.00 3.25 v3 140 150 i 3.25 3.50 w1 150 160 sz5 - p1 - wn - 00 v1 118.5 130 refer to page.13 g 2.75 3.00 v2 130 140 h 3.00 3.25 v3 140 150 i 3.25 3.50 w1 150 160 sz5 - p1 - wn - c8 u3 109 118.5 refer to page.13 g 2.75 3.00 v1 118.5 130 h 3.00 3.25 v2 130 140 i 3.25 3.50 v3 140 150 sz5 - p1 - ww - c8 u2 100 109 refer to page.14 g 2.75 3.00 u3 109 118.5 h 3.00 3.25 v1 118.5 130 i 3.25 3.50 v2 130 140 table 5. bin code description (@i f =350ma, t j =25 )
rev1.0, november 18, 2013 www.seoulsemicon.com z5 - p1 C high - power led 12 color bin structure table 6. flux bin code description (@ t j =85 ) luminous flux (lm) bin code 350ma* 700ma* min. max. min. max. u2 90 98 159 173 u3 98 107 173 188 v1 107 118 188 207 v2 118 127 207 222 v3 127 136 222 238 w1 136 145 238 254 forward voltage (v f ) bin code 350ma* 700ma* min. max. min. max. g 2.61 2.85 2.79 3.05 h 2.85 3.09 3.05 3.30 i 3.09 3.32 3.30 3.55 table 7. vf bin code description (@ t j =85 ) * no values are provided by real measurement. only for reference purpose.
rev1.0, november 18, 2013 www.seoulsemicon.com z5 - p1 C high - power led 13 color bin structure a0 a1 a2 a3 a4 cie x cie y cie x cie y cie x cie y cie x cie y cie x cie y 0.3028 0.3304 0.3115 0.3393 0.3041 0.3240 0.3126 0.3324 0.3055 0.3177 0.3041 0.3240 0.3126 0.3324 0.3055 0.3177 0.3136 0.3256 0.3068 0.3113 0.3126 0.3324 0.3210 0.3408 0.3136 0.3256 0.3216 0.3334 0.3146 0.3187 0.3115 0.3393 0.3205 0.3481 0.3126 0.3324 0.3210 0.3408 0.3136 0.3256 a5 a6 a7 a8 a9 cie x cie y cie x cie y cie x cie y cie x cie y cie x cie y 0.3136 0.3256 0.3068 0.3113 0.3146 0.3187 0.3082 0.3046 0.3155 0.3120 0.3146 0.3187 0.3082 0.3046 0.3155 0.3120 0.3096 0.2980 0.3164 0.3046 0.3221 0.3261 0.3155 0.3120 0.3225 0.3190 0.3164 0.3046 0.3230 0.3110 0.3216 0.3334 0.3146 0.3187 0.3221 0.3261 0.3155 0.3120 0.3225 0.3190 b0 b1 b2 b3 b4 cie x cie y cie x cie y cie x cie y cie x cie y cie x cie y 0.3207 0.3462 0.3292 0.3539 0.3212 0.3389 0.3293 0.3461 0.3217 0.3316 0.3212 0.3389 0.3293 0.3461 0.3217 0.3316 0.3293 0.3384 0.3222 0.3243 0.3293 0.3461 0.3373 0.3534 0.3293 0.3384 0.3369 0.3451 0.3294 0.3306 0.3292 0.3539 0.3376 0.3616 0.3293 0.3461 0.3373 0.3534 0.3293 0.3384 b5 b6 b7 b8 b9 cie x cie y cie x cie y cie x cie y cie x cie y cie x cie y 0.3293 0.3384 0.3222 0.3243 0.3294 0.3306 0.3200 0.3572 0.3290 0.3656 0.3294 0.3306 0.3226 0.3178 0.3295 0.3234 0.3207 0.3462 0.3292 0.3539 0.3366 0.3369 0.3295 0.3234 0.3364 0.3288 0.3292 0.3539 0.3376 0.3616 0.3369 0.3451 0.3294 0.3306 0.3366 0.3369 0.3290 0.3656 0.3381 0.3740 c0 c1 c2 c3 c4 cie x cie y cie x cie y cie x cie y cie x cie y cie x cie y 0.3376 0.3616 0.3463 0.3687 0.3373 0.3534 0.3456 0.3601 0.3369 0.3451 0.3373 0.3534 0.3456 0.3601 0.3369 0.3451 0.3448 0.3514 0.3366 0.3369 0.3456 0.3601 0.3539 0.3669 0.3448 0.3514 0.3526 0.3578 0.3440 0.3428 0.3463 0.3687 0.3552 0.3760 0.3456 0.3601 0.3539 0.3669 0.3448 0.3514 c5 c6 c7 c8 c9 cie x cie y cie x cie y cie x cie y cie x cie y cie x cie y 0.3448 0.3514 0.3366 0.3369 0.3440 0.3428 0.3381 0.3740 0.3470 0.3810 0.3440 0.3428 0.3364 0.3288 0.3433 0.3345 0.3376 0.3616 0.3463 0.3687 0.3514 0.3487 0.3433 0.3345 0.3500 0.3400 0.3463 0.3687 0.3552 0.3760 0.3526 0.3578 0.3440 0.3428 0.3514 0.3487 0.3470 0.3810 0.3572 0.3891 cie chromaticity diagram (cool white), t j =25 , i f = 350ma
rev1.0, november 18, 2013 www.seoulsemicon.com z5 - p1 C high - power led 14 color bin structure cie chromaticity diagram (neutral white), t j =25 , i f = 350ma d0 d1 d2 d3 d4 cie x cie y cie x cie y cie x cie y cie x cie y cie x cie y 0.3548 0.3736 0.3641 0.3804 0.3536 0.3646 0.3625 0.3711 0.3524 0.3555 0.3536 0.3646 0.3625 0.3711 0.3524 0.3555 0.3608 0.3616 0.3512 0.3465 0.3625 0.3711 0.3714 0.3775 0.3608 0.3616 0.3692 0.3677 0.3590 0.3521 0.3641 0.3804 0.3736 0.3874 0.3625 0.3711 0.3714 0.3775 0.3608 0.3616 d5 d6 d7 d8 d9 cie x cie y cie x cie y cie x cie y cie x cie y cie x cie y 0.3608 0.3616 0.3512 0.3465 0.3590 0.3521 0.3562 0.3826 0.3661 0.3900 0.3590 0.3521 0.3497 0.3385 0.3575 0.3441 0.3548 0.3736 0.3641 0.3804 0.3670 0.3578 0.3575 0.3441 0.3650 0.3489 0.3641 0.3804 0.3736 0.3874 0.3692 0.3677 0.3590 0.3521 0.3670 0.3578 0.3661 0.3900 0.3760 0.3974 e0 e1 e2 e3 e4 cie x cie y cie x cie y cie x cie y cie x cie y cie x cie y 0.3736 0.3874 0.3869 0.3958 0.3714 0.3775 0.3842 0.3855 0.3692 0.3677 0.3714 0.3775 0.3842 0.3855 0.3692 0.3677 0.3813 0.3751 0.3670 0.3578 0.3842 0.3855 0.3970 0.3935 0.3813 0.3751 0.3934 0.3825 0.3783 0.3646 0.3869 0.3958 0.4006 0.4044 0.3842 0.3855 0.3970 0.3935 0.3813 0.3751 e5 e6 e7 e8 e9 cie x cie y cie x cie y cie x cie y cie x cie y cie x cie y 0.3813 0.3751 0.3670 0.3578 0.3783 0.3646 0.3760 0.3974 0.3902 0.4067 0.3783 0.3646 0.3650 0.3489 0.3758 0.3550 0.3736 0.3874 0.3869 0.3958 0.3898 0.3716 0.3758 0.3550 0.3863 0.3610 0.3869 0.3958 0.4006 0.4044 0.3934 0.3825 0.3783 0.3646 0.3898 0.3716 0.3902 0.4067 0.4044 0.4160
rev1.0, november 18, 2013 www.seoulsemicon.com z5 - p1 C high - power led 15 color bin structure cie chromaticity diagram (warm white), t j =25 , i f = 350ma f 0 f1 f2 f3 f4 cie x cie y cie x cie y cie x cie y cie x cie y cie x cie y 0.3996 0.4015 0.4146 0.4089 0.396 0.3907 0.4104 0.3978 0.3925 0.3798 0.396 0.3907 0.4104 0.3978 0.3925 0.3798 0.4062 0.3865 0.3889 0.369 0.4104 0.3978 0.4248 0.4048 0.4062 0.3865 0.4198 0.3931 0.4017 0.3751 0.4146 0.4089 0.4299 0.4165 0.4104 0.3978 0.4248 0.4048 0.4062 0.3865 f5 g11 g12 g13 g14 cie x cie y cie x cie y cie x cie y cie x cie y cie x cie y 0.4062 0.3865 0.4299 0.4165 0.4261 0.4077 0.4223 0.3990 0.4185 0.3902 0.4017 0.3751 0.4261 0.4077 0.4223 0.3990 0.4185 0.3902 0.4147 0.3814 0.4147 0.3814 0.4324 0.4100 0.4284 0.4011 0.4243 0.3922 0.4203 0.3834 0.4198 0.3931 0.4365 0.4189 0.4324 0.4100 0.4284 0.4011 0.4243 0.3922 g21 g22 g23 g24 g31 cie x cie y cie x cie y cie x cie y cie x cie y cie x cie y 0.4365 0.4189 0.4324 0.4100 0.4284 0.4011 0.4243 0.3922 0.4430 0.4212 0.4324 0.4100 0.4284 0.4011 0.4243 0.3922 0.4203 0.3834 0.4387 0.4122 0.4387 0.4122 0.4345 0.4033 0.4302 0.3943 0.4259 0.3853 0.4451 0.4145 0.4430 0.4212 0.4387 0.4122 0.4345 0.4033 0.4302 0.3943 0.4496 0.4236 g32 g33 g34 g41 g42 cie x cie y cie x cie y cie x cie y cie x cie y cie x cie y 0.4387 0.4122 0.4345 0.4033 0.4302 0.3943 0.4496 0.4236 0.4451 0.4145 0.4345 0.4033 0.4302 0.3943 0.4259 0.3853 0.4451 0.4145 0.4406 0.4055 0.4406 0.4055 0.4361 0.3964 0.4316 0.3873 0.4515 0.4168 0.4468 0.4077 0.4451 0.4145 0.4406 0.4055 0.4361 0.3964 0.4562 0.4260 0.4515 0.4168 g43 g44 h11 h12 h13 cie x cie y cie x cie y cie x cie y cie x cie y cie x cie y 0.4406 0.4055 0.4361 0.3964 0.4625 0.4275 0.4575 0.4182 0.4526 0.4090 0.4361 0.3964 0.4316 0.3873 0.4575 0.4182 0.4526 0.4090 0.4477 0.3998 0.4420 0.3985 0.4373 0.3893 0.4515 0.4168 0.4468 0.4077 0.4420 0.3985 0.4468 0.4077 0.4420 0.3985 0.4562 0.4260 0.4515 0.4168 0.4468 0.4077 h14 h21 h22 h23 h24 cie x cie y cie x cie y cie x cie y cie x cie y cie x cie y 0.4477 0.3998 0.4687 0.4289 0.4636 0.4197 0.4585 0.4104 0.4534 0.4012 0.4428 0.3906 0.4636 0.4197 0.4585 0.4104 0.4534 0.4012 0.4483 0.3919 0.4373 0.3893 0.4575 0.4182 0.4526 0.4090 0.4477 0.3998 0.4428 0.3906 0.4420 0.3985 0.4625 0.4275 0.4575 0.4182 0.4526 0.4090 0.4477 0.3998 h31 h32 h33 h34 h41 cie x cie y cie x cie y cie x cie y cie x cie y cie x cie y 0.4750 0.4304 0.4697 0.4211 0.4644 0.4118 0.4591 0.4025 0.4810 0.4319 0.4697 0.4211 0.4644 0.4118 0.4591 0.4025 0.4538 0.3932 0.4758 0.4225 0.4636 0.4197 0.4585 0.4104 0.4534 0.4012 0.4483 0.3919 0.4697 0.4211 0.4687 0.4289 0.4636 0.4197 0.4585 0.4104 0.4534 0.4012 0.4750 0.4304 h42 h43 h44 cie x cie y cie x cie y cie x cie y 0.4758 0.4225 0.4703 0.4132 0.4648 0.4038 0.4703 0.4132 0.4648 0.4038 0.4593 0.3944 0.4644 0.4118 0.4591 0.4025 0.4538 0.3932 0.4697 0.4211 0.4644 0.4188 0.4591 0.4025
rev1.0, november 18, 2013 www.seoulsemicon.com z5 - p1 C high - power led 16 mechanical dimensions notes : (1) all dimensions are in millimeters. (2) scale : none (3) undefined tolerance is 0.1mm
rev1.0, november 18, 2013 www.seoulsemicon.com z5 - p1 C high - power led 17 emitter tape & reel packaging
rev1.0, november 18, 2013 www.seoulsemicon.com z5 - p1 C high - power led 18 product nomenclature part number code description part number value x 1 company s x 2 z - power led series number z x 3 pkg series 5 x 4 pkg series p p series x 5 revision number 1 new version x 6 x 7 color specification w0 pure white wn neutral white ww warm white x 8 x 9 color specification c8 cri (min.) 80 c9 cri (min.) 90 00 the others lot number code description y 1 year y 2 month y 3 day y 4 production area y 5 mass order y 6 taping number y 7 reel number y 8 internal management number table 8. part numbering system : x 1 x 2 x 3 - x 4 x 5 - x 6 x 7 - x 8 x 9 table 9. lot numbering system : y 1 y 1 y 2 y 3 y 3 y 4 y 5 y 5 y 5 y 5 - y 6 y 6 y 6 - y 7 y 7 y 7 - y 8 y 8 y 8 y 8 y 8 y 8 y 8 lot number : y 1 y 1 y 2 y 3 y 3 y 4 y 5 y 5 y 5 y 5 - y 6 y 6 y 6 - y 7 y 7 y 7 - y 8 y 8 y 8 y 8 y 8 y 8 y 8 quantity : 1000 rank : z 1 z 1 z 2 z 2 z 3 ssc part number : x 1 x 2 x 3 - x 4 x 5 - x 6 x 7 - x 8 x 9 [1] z 1 : flux rank z 2 : chromaticity z 3 : vf rank
rev1.0, november 18, 2013 www.seoulsemicon.com z5 - p1 C high - power led 19 recommended solder pad notes : (1) all dimensions are in millimeters. (2) scale : none (3) this drawing without tolerances are for reference only. (4) undefined tolerance is 0.1mm.
rev1.0, november 18, 2013 www.seoulsemicon.com z5 - p1 C high - power led 20 reflow soldering characteristics table 10. caution (1) reflow soldering is recommended not to be done more than two times. in the case of more than 24 hours passed soldering after first, leds will be damaged. (2) repairs should not be done after the leds have been soldered. when repair is unavoidable, suitable tools must be used. (3) die slug is to be soldered . (4) when soldering, do not put stress on the leds during heating. (5) after soldering, do not warp the circuit board. ipc/jedec j - std - 020 profile feature sn - pb eutectic assembly pb - free assembly average ramp - up rate (tsmax to tp) 3 c/second max. 3 c/second max. preheat - temperature min ( tsmin ) - temperature max ( tsmax ) - time ( tsmin to tsmax ) ( ts ) 100 c 150 c 60 - 120 seconds 150 c 200 c 60 - 180 seconds time maintained above: - temperature (tl) - time (tl) 183 c 60 - 150 seconds 217 c 60 - 150 seconds peak temperature (tp) 215 260 time within 5 c of actual peak temperature (tp)2 10 - 30 seconds 20 - 40 seconds ramp - down rate 6 c/second max. 6 c/second max. time 25 c to peak temperature 6 minutes max. 8 minutes max.
rev1.0, november 18, 2013 www.seoulsemicon.com z5 - p1 C high - power led 21 handling of silicone resin for leds (1) during processing, mechanical stress on the surface should be minimized as much as possible. sharp objects of all types should not be used to pierce the sealing compound. (2) in general, leds should only be handled from the side. by the way, this also applies to leds without a silicone sealant, since the surface can also become scratched. (3) when populating boards in smt production, there are basically no restrictions regarding the form of the pick and place nozzle, except that mechanical pressure on the surface of the resin must be prevented. this is assured by choosing a pick and place nozzle which is larger than the leds reflector area. (4) silicone differs from materials conventionally used for the manufacturing of leds. these conditions must be considered during the handling of such devices. compared to standard encapsulants , silicone is generally softer, and the surface is more likely to attract dust. as mentioned previously, the increased sensitivity to dust requires special care during processing. in cases where a minimal level of dirt and dust particles cannot be guaranteed, a suitable cleaning solution must be applied to the surface after the soldering of components. (5) seoul semiconductor suggests using isopropyl alcohol for cleaning. in case other solvents are used, it must be assured that these solvents do not dissolve the package or resin. ultrasonic cleaning is not recommended. ultrasonic cleaning may cause damage to the led. (6) please do not mold this product into another resin (epoxy, urethane, etc) and do not handle this product with acid or sulfur material in sealed space. (7) avoid leaving fingerprints on silicone resin parts.
rev1.0, november 18, 2013 www.seoulsemicon.com z5 - p1 C high - power led 22 precaution for use (1) storage to avoid the moisture penetration, we recommend storing z5 series leds in a dry box with a desiccant . the recommended storage temperature range is 5 to 30 and a maximum humidity of rh50%. (2) use precaution after opening the packaging use proper smd techniques when the led is to be soldered dipped as separation of the lens may affect the light output efficiency. pay attention to the following: a. recommend conditions after opening the package - sealing / temperature : 5 ~ 40 humidity : less than rh30% b. if the package has been opened more than 1 year (msl 2) or the color of the desiccant changes, components should be dried for 10 - 12hr at 60 5 (3) do not apply mechanical force or excess vibration during the cooling process to normal temperature after soldering. (4) do not rapidly cool device after soldering. (5) components should not be mounted on warped (non coplanar) portion of pcb. (6) radioactive exposure is not considered for the products listed here in. (7) gallium arsenide is used in some of the products listed in this publication. these products are dangerous if they are burned or shredded in the process of disposal. it is also dangerous to drink the liquid or inhale the gas generated by such products when chemically disposed of. (8) this device should not be used in any type of fluid such as water, oil, organic solvent and etc. when washing is required, ipa (isopropyl alcohol) should be used. (9) when the leds are in operation the maximum current should be decided after measuring the package temperature. (10) leds must be stored properly to maintain the device. if the leds are stored for 3 months or more after being shipped from seoul semiconductor. a sealed container with a nitrogen atmosphere should be used for storage. (11) the appearance and specifications of the product may be modified for improvement without notice. (12) long time exposure of sunlight or occasional uv exposure will cause lens discoloration.
rev1.0, november 18, 2013 www.seoulsemicon.com z5 - p1 C high - power led 23 precaution for use (13) vocs (volatile organic compounds) emitted from materials used in the construction of fixtures ca n penetrate silicone encapsulants of leds and discolor when exposed to heat and photonic energy. t he result can be a significant loss of light output from the fixture. knowledge of the properties of the m aterials selected to be used in the construction of fixtures can help prevent these issues. (14) the slug is electrically isolated. (15) attaching leds, do not use adhesives that outgas organic vapor. (16) the driving circuit must be designed to allow forward voltage only when it is on or off. if the rev erse voltage is applied to led, migration can be generated resulting in led damage. (17) leds are sensitive to electro - static discharge (esd) and electrical over stress (eos). below is a list of suggestions that seoul semiconductor purposes to minimize these effects. a. esd (electro static discharge) electrostatic discharge (esd) is the defined as the release of static electricity when two objects come into contact. while most esd events are considered harmless, it can be an expensive problem in many industrial environments during production and storage. the damage from esd to an leds may cause the product to demonstrate unusual characteristics such as : - increase in reverse leakage current lowered turn - on voltage - abnormal emissions from the led at low current the following recommendations are suggested to help minimize the potential for an esd event. one or more recommended work area suggestions : - ionizing fan setup - esd table/shelf mat made of conductive materials - esd safe storage containers one or more personnel suggestion options : - antistatic wrist - strap - antistatic material shoes - antistatic clothes environmental controls: - humidity control (esd gets worse in a dry environment)
rev1.0, november 18, 2013 www.seoulsemicon.com z5 - p1 C high - power led 24 precaution for use b. eos (electrical over stress) electrical over - stress (eos) is defined as damage that may occur when an electronic device is subjected to a current or voltage that is beyond the maximum specification limits of the device. the effects from an eos event can be noticed through product performance like: - changes to the performance of the led package (if the damage is around the bond pad area and since the package is completely encapsulated the package may turn on but flicker show severe performance degradation.) - changes to the light output of the luminaire from component failure - components on the board not operating at determined drive power failure of performance from entire fixture due to changes in circuit voltage and current across total circuit causing trickle down failures. it is impossible to predict the failure mode of every led exposed to electrical overstress as the failure modes have been investigated to vary, but there are some common signs that will indicate an eos event has occurred: - damaged may be noticed to the bond wires (appearing similar to a blown fuse) - damage to the bond pads located on the emission surface of the led package (shadowing can be noticed around the bond pads while viewing through a microscope) - anomalies noticed in the encapsulation and phosphor around the bond wires. - this damage usually appears due to the thermal stress produced during the eos event. c. to help minimize the damage from an eos event seoul semiconductor recommends utilizing: - a surge protection circuit - an appropriately rated over voltage protection device - a current limiting device
rev1.0, november 18, 2013 www.seoulsemicon.com z5 - p1 C high - power led 25 company information published by seoul semiconductor ? 2013 all rights reserved. company information seoul semiconductor (www.seoulsemicon.com) manufacturers and packages a wide selection of light emitting diodes (leds) for the automotive, general illumination/lighting, home appliance, signage and back lighting markets. the company is the worlds fifth largest led supplier, holding more than 10,000 patents globally, while offering a wide range of led technology and production capacity in areas such as npola , "acrich", the worlds first commercially produced ac led, and "acrich mjt - multi - junction technology" a proprietary family of high - voltage leds. the companys broad product portfolio includes a wide array of package and device choices such as acrich and acirch2, high - brightness leds, mid - power leds, side - view leds, and through - hole type leds as well as custom modules, displays, and sensors. legal disclaimer information in this document is provided in connection with seoul semiconductor products. with respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, seoul semiconductor hereby disclaims any and all warranties and liabilities of any kind, including without limitation, warranties of non - infringement of intellectual property rights of any third party. the appearance and specifications of the product can be changed to improve the quality and/or performance without notice.

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